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VT S1080 Automatic Optical Inspection Machine Original And Used
Omron 3D AOI VT-S1080, Original and Used Automatic Optical Inspection Machine
The VT-S1080 is the world’s most advanced 3D AOI system, designed for maximum System Performance and High-Quality Productivity. Designed for flexible manufacturing, saving manpower with innovative AI Programming. First Pass Yield efficiency up to 99%. Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated solder shapes. Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors. Realization of Solder Wetting Direction directly relating to IPC Standards. Innovative AI tools that support skill-less labor-saving tuning. Full 3D compliance to IPC – based inspection. Advanced angle-view inspection of hidden solder joints. Developed with I4.0 in mind for advanced Machine to Machine communication. Multi-lateral system monitoring and Predictive Maintenance for 100%, utilization for Production. Global Library to maintain the same quality standard of manufacturing in all global sites. High reliability OCR / OCV image detection. Unique Single Hardware across all S10 Series Platforms. Prepared for the next-generation hardware, camera/GPU/PC for higher detectability/speed capability.
Omron 3D AOI VT-S1080
FOV 50.0 x 37.5mm
Max PCB: 510(W) x 680(D)mm
Weight Approx. 1250 kg
Dimensions 1180(W) x 1450(D) x 1500(H)mm
Features:
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi-Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.
M2M*1 system focusing on quality
1. Preventing defects by:
monitoring and reporting fluctuations in the measured values during production
visualizing defect trends associated with chip mounter hardware such as heads and nozzles
2. Visualizing the quality by:
process comparison
displaying production status
linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the inspection results after the solder reflow process
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
Specifications:
| Type | VT-S1080 | |
| Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm | |
| Weight | Approx. 1250 kg | |
|
Power supply | Voltage | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% |
| Rated power | 2.0 kVA (Maximum current 10 A) | |
| Line height | 900±20mm | |
| Air supply | Not required | |
| Operating temperature range |
10 to 35°C | |
| Operating humidity range | 35 to 80% RH (Non-condensing)
| |
|
Vision system | Imaging system | 12M pixel camera |
| Inspection principle | MDMC*1 illumination + 3D reconstruction through MPS*2 technology | |
| Image resolution | 12.5µm | |
| FOV | 50.0 x 37.5mm | |
| Supported PCB size | 50(W) x 50(D)～510(W) x 680(D)mm | |
| Weight | (Max) 4 kg | |
| Thickness | 0.4～4mm | |
|
Clearance | Above the conveyor belt: 54 mm or less; Below the conveyor belt: 50 mm or less (Including board thickness/curvature/bend/part tolerance, etc.) | |
| Height measurement range |
25mm | |
|
Inspection item | Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | |