INFINITE AUTOMATION CO ., LIMITED
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TR7700QM SII Smart 3D SMT AOI Machine PCB Automated Inspection Machine
Pre-owned TR7700QM SII Smart 3D AOI Machine, 3D PCB Automated Inspection Machine
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
Features:
• Semiconductor and Packaging technology Inspection.
• 5.5 μm Resolution for Ultra-High Precision Metrology-grade Inspection
• Ready to Inspect in Minutes with TRI's Smart Programming
• Multiple 3D Technologies for Full coverage Inspection
Specifications:
| Imaging Method | Stop-and-Go |
| Top Camera | 12 MP High Speed Camera |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 μm |
| Lighting | Multi-phase True Color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 20 mm |
| Imaging Speed | Up to 7.7 cm²/sec |
| X-Axis Control | Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control | Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution | 1 μm with Optional Linear Encoder |
| Max PCB Size | 400 x 330 mm |
| PCB Thickness | 0.6 - 5mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm. Optional: 5 mm |
| Conveyor | 880 - 920 mm |
| Component | Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component |
| Solder | Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
| WxDxH | 1000 x 1460 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
| Weight | 785 kg |